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Silicon carbide technology reshapes the global industrial landscape.

2025-06-05 77

The global silicon carbide (SiC) market is experiencing explosive growth. TrendForce data shows that the market size of SiC power devices will exceed US$3.3 billion in 2025, with a compound annual growth rate of over 38%. This rapid growth stems from the urgent demand for high-efficiency semiconductor materials in industries such as new energy vehicles, photovoltaic energy storage, and rail transportation.


 


In the field of electric vehicles, silicon carbide devices reduce motor control system losses by 50%, and can reduce charging time to 15 minutes when used with an 800V high-voltage platform. Currently, more than 60% of newly launched high-end models in the world use silicon carbide modules, which increase driving range by an average of 8%. 5G base station construction also benefits from this, as the high-frequency signal transmission efficiency supported by silicon carbide RF devices is 40% higher than that of traditional solutions, and a single station can save 24,000 kWh of electricity per year.

 

The photovoltaic inverter market shows a more significant substitution effect. The efficiency of the string inverter system using silicon carbide MOSFET has exceeded 99%, the volume has been reduced by 30%, and the life cycle operation and maintenance cost has dropped by 45%. According to statistics from the International Energy Agency, the penetration rate of silicon carbide devices in newly built photovoltaic power stations has reached 27% in 2024, and it is expected to cover more than 75% of high-end application scenarios in 2030.


 


Despite the broad prospects, the industry chain still faces technical bottlenecks such as 6-inch wafer yield (currently 65%) and substrate cost (accounting for 47% of the total device cost). The latest breakthrough in laser stripping technology by the Fraunhofer Institute in Germany has increased the mass production yield of 8-inch silicon carbide substrates to 82%, paving the way for large-scale applications in 2026.

 

The current competition pattern of the three poles of the United States, Europe and Asia is gradually becoming clear: North America dominates the automotive-grade chip certification system, Europe is deeply engaged in high-end equipment manufacturing, and the Asia-Pacific region occupies 60% of the global consumer market with application scenarios such as photovoltaics and energy storage. As countries include silicon carbide in the list of strategic new materials, this technological competition related to future energy efficiency is rewriting the global high-end manufacturing landscape.

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